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MRO Electronic Supply Ltd.

MG Chemicals Non-Silicone Heat Transfer Compound

MG Chemicals Non-Silicone Heat Transfer Compound
  • Designed for transferring heat away from electrical and electronic devices
  • Use with heat sinks or metal chassis
  • Will not dry or harden
  • Uses synthetic fluids and metal oxide fillers
  • No migration or component contamination
  • RoHS Compliant

More details


$11.82

8610-60G

Contact MRO for availability

30 other products in the same category:

Appearance:

Off-White Paste

Bleed %:

1.0% Max. (24 hours @ 200°C)

Evaporation:

2.0% Max. (24 hours @ 200°C)

Dropping Point:

> 500°F/260°C

 Operating Temperature: 

40°C to 200°C

Thermal Conductivity:

0.773 W/m·k

Dielectric Strength:

350 V/mil

Dielectric Constant:

4.4

Dissipation Factor:

0.0021 @ 1000Hz

Resistivity:

6.38x10^13 ohm·cm @ 21°C

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